Patent Number: 8,798,782

Title: Material removal depth measurement by scribing

Abstract: The described embodiment relates generally to the polishing of a device housing. The device housing can be formed of a thermoplastic, or a metal such as aluminum or stainless steel. More particularly, a method and an apparatus are described for accurately measuring the amount of material removed during a polishing process. Accurate measurement of such a polishing process can be especially helpful in measuring material removal on curved surfaces and edges where material removal rates tend to be less predictable.

Inventors: Lancaster-Larocque; Simon R. (Gloucester, CA), Whipple; Lucas Allen (Belmont, CA)

Assignee: Apple Inc.

International Classification: G06F 19/00 (20110101); B24B 1/00 (20060101); F27D 11/00 (20060101); B24B 49/00 (20120101); B24B 51/00 (20060101)

Expiration Date: 8/05/12018