Patent Number: 8,814,317

Title: Liquid ejection head and method of manufacturing the same

Abstract: Provided is a liquid ejection head formed by performing bonding and fixing operations speedily and highly accurately when a recording element board is bonded to a supporting member, the liquid ejection head having a high liquid-landing accuracy and achieving a high printing quality. A method of manufacturing the liquid ejection head is also provided. Heat is conducted from a holding member, which supports the recording element board, to a thermosetting adhesive via the supporting member, which supports the recording element board, in order to accelerate the curing of the adhesive.

Inventors: Enomoto; Takanori (Tokyo, JP)

Assignee: Canon Kabushiki Kaisha

International Classification: B41J 2/015 (20060101); B41J 2/04 (20060101); B23P 17/00 (20060101)

Expiration Date: 8/26/12018