Patent Number: 8,815,060

Title: Method for minimizing magnetically dead interfacial layer during COC process

Abstract: A method for applying a protective layer to an electronic device such as the ABS of a slider, magnetic head, etc. for reducing paramagnetic deadlayer thickness includes selecting an etching angle for minimizing formation of a paramagnetic deadlayer at an interface of an electronic device and an adhesive layer subsequently formed on the electronic device, etching a surface of an electronic device at the selected angle, the selected angle being less than about 75 degrees from an imaginary line extending perpendicular to the surface, forming an adhesive layer on the etched surface of the electronic device, and forming a protective layer on the adhesive layer. A magnetic head formed by the process is also disclosed.

Inventors: Flint; Eric Wayne (San Jose, CA), Shi; Ning (San Jose, CA), Xiao; Qi-Fan (San Jose, CA)

Assignee: HGST Netherlands B.V.

International Classification: C23C 14/00 (20060101); C23C 14/32 (20060101); B44C 1/22 (20060101); C03C 15/00 (20060101); C03C 25/68 (20060101); C23F 1/00 (20060101); C23C 14/02 (20060101)

Expiration Date: 8/26/12018