Patent Number: 8,815,070

Title: Microelectrode array architecture

Abstract: Disclosed herein is a device A device of the microelectrode array architecture, comprising: (a) a bottom plate comprising an array of multiple microelectrodes disposed on a top surface of a substrate covered by a dielectric layer; wherein each of the microelectrode is coupled to at least one grounding elements of a grounding mechanism, wherein a hydrophobic layer is disposed on the top of the dielectric layer and the grounding elements to make hydrophobic surfaces with the droplets; (b) a field programmability mechanism for programming a group of configured-electrodes to generate microfluidic components and layouts with selected shapes and sizes; and, (c) a system management unit, comprising: (i) a droplet manipulation unit; and (ii) a system control unit.

Inventors: Wang; Gary Chorng-Jyh (Cupertino, CA), Ho; Ching Yen (Los Gatos, CA), Hwang; Wen Jang (Fremont, CA), Wang; Wilson Wen-Fu (San Jose, CA)

Assignee: Sparkle Power, Inc.

International Classification: B01J 8/00 (20060101)

Expiration Date: 8/26/12018