Patent Number: 8,815,371

Title: Structure and method for forming detailed channels for thin walled components using thermal spraying

Abstract: A coated substrate with a subsurface cooling channel having no corner disposed proximate a seam between the substrate and the coating. A method for forming such a structure, including forming a groove in a surface of a substrate, forming a preform having a cooperating portion and a protruding portion, inserting the cooperating portion of the preform into the groove, leaving the protruding portion of the preform protruding beyond the surface of the substrate, applying a layer of a coating material to the surface of the substrate and the protruding portion of the perform, and removing the preform, thereby creating a cooling channel.

Inventors: Arrell; Douglas J. (Oviedo, FL), James; Allister W. (Orlando, FL), Kulkarni; Anand A. (Oviedo, FL)

Assignee: Siemens Energy, Inc.

International Classification: B32B 3/00 (20060101); F01D 5/20 (20060101); F01D 5/08 (20060101); B32B 3/20 (20060101)

Expiration Date: 8/26/12018