Patent Number: 8,815,387

Title: Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer

Abstract: The object of the present invention is to provide a copper foil with an ultra thin resin layer for a printed wiring board without roughening treatment. In order to achieve the object, there is adopted a copper foil with an ultra thin adhesive layer for a printed wiring board 1 or the like, which is a copper foil provided with an ultra thin primer resin layer for securing good laminating adhesiveness with a resin base material on one side of a copper foil 3 without roughening treatment, characterized in that a silane coupling agent layer 2 is formed on a surface of the copper foil without the roughening treatment having a surface roughness (Rz) of 2 .mu.m or below, and an ultra thin primer resin layer 4 having a converted thickness of 1 to 5 .mu.m is formed on the silane coupling agent layer 2.

Inventors: Sato; Tetsuro (Ageo, JP), Matsushima; Toshifumi (Ageo, JP)

Assignee: Mitsu Minning & Smelting Co., Ltd.

International Classification: B32B 15/08 (20060101); B32B 15/20 (20060101); H05K 3/38 (20060101)

Expiration Date: 8/26/12018