Patent Number: 8,815,489

Title: Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film

Abstract: Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film.

Inventors: Jeong; Ji-Young (Uiwang-si, KR), Lee; Jin-Young (Uiwang-si, KR), Lee; Jong-Hwa (Uiwang-si, KR), Cho; Hyun-Yong (Uiwang-si, KR), Kim; Sang-Soo (Uiwang-si, KR), Yoon; Eun-Kyung (Uiwang-si, KR), Lee; Jun-Ho (Uiwang-si, KR), Cha; Myoung-Hwan (Uiwang-si, KR), Hwang; Eun-Ha (Uiwang-si, KR)

Assignee: Cheil Industries Inc.

International Classification: G03F 7/023 (20060101)

Expiration Date: 8/26/12018