Patent Number: 8,816,360

Title: Multi-chip package cross-reference to related applications

Abstract: A multi-chip package includes a lower substrate; at least two semiconductor chips stacked over the lower substrate and each defined with a via hole; an upper substrate coupled to a semiconductor chip positioned uppermost among the semiconductor chips; a light emitting part coupled to the lower substrate corresponding to the via hole; an electrowetting liquid lens coupled to a lower surface of the upper substrate for receiving a signal transferred from the light emitting part through the via hole; a light receiving part coupled to a sidewall of the via hole of each semiconductor chip configured to receive a signal from the electrowetting liquid lens.

Inventors: Lee; Seung Yeop (Seoul, KR)

Assignee: SK Hynix Inc.

International Classification: H01L 27/15 (20060101); H01L 29/16 (20060101); H01L 31/12 (20060101); H01L 33/00 (20100101)

Expiration Date: 8/26/12018