Patent Number: 8,816,381

Title: Light-emitting device, method of manufacturing light-emitting device, and illumination device

Abstract: According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected.

Inventors: Betsuda; Nobuhiko (Yokosuka, JP), Ogawa; Kozo (Yokosuka, JP), Nishimura; Koyoshi (Yokosuka, JP), Shibusawa; Soichi (Yokosuka, JP)

Assignee: Toshiba Lighting & Technology Corporation

International Classification: H01L 33/00 (20100101)

Expiration Date: 8/26/12018