Patent Number: 8,816,478

Title: Semiconductor device having penetration electrode penetrating through semiconductor substrate

Abstract: Disclosed herein is a device that includes: a semiconductor substrate having a first surface on which a plurality of circuit elements are formed and a second surface opposite to the first surface; an insulating layer covering the second surface of the semiconductor substrate; and a penetration electrode having a body section that penetrates through the semiconductor substrate and a protruding section that is connected to one end of the body section and protrudes from the second surface of the semiconductor substrate. The second surface of the semiconductor substrate is covered with the protruding section of the penetration electrode without intervention of the insulating layer.

Inventors: Kanegae; Yoshiharu (Hitachi, JP), Tanie; Hisashi (Hitachi, JP), Watanabe; Mitsuhisa (Tokyo, JP), Kusanagi; Keiyo (Tokyo, JP)

Assignee: PS4 Luxco S.A.R.L.

International Classification: H01L 29/40 (20060101)

Expiration Date: 8/26/12018