Patent Number: 8,816,480

Title: Electronic device packages and methods of manufacturing the same

Abstract: The electronic device package includes a package substrate including a frame portion and a cantilever portion surrounded by the frame portion, at least one semiconductor chip mounted on the cantilever portion, and a molding member disposed on the package substrate to cover the at least one semiconductor chip. The cantilever portion has a first edge connected to the frame portion and declines from the first edge toward a second edge located opposite to the first edge. Related methods are also provided.

Inventors: Kang; Tae Jim (Seoul, KR)

Assignee: SK Hynix Inc.

International Classification: H01L 23/495 (20060101)

Expiration Date: 8/26/12018