Patent Number: 8,816,499

Title: Electrical interconnections of semiconductor devices and methods for fabricating the same

Abstract: Provided are electrical interconnections and methods for fabricating the same. The electrical interconnection may include a substrate including a bonding pad, a solder ball electrically connected to the bonding pad, a solder supporter on the bonding pad, a portion of the solder ball filling the solder supporter, and a metal layer between the bonding pad and the solder supporter, the metal layer having an ionization tendency lower than the bonding pad.

Inventors: Choi; Ju-il (Suwon-si, KR), Park; Jeong-Woo (Suwon-si, KR), Jin; Jeonggi (Osan-si, KR), Park; Yeun-Sang (Yongin-si, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: H01L 23/488 (20060101)

Expiration Date: 8/26/12018