Patent Number: 8,816,514

Title: Microelectronic assembly with joined bond elements having lowered inductance

Abstract: First and second bond elements, e.g., wire bonds, electrically connect a chip contact with one or more substrate contacts of a substrate, and can be arranged so that the second bond element is joined to the first bond element at each end and so that the second bond element does not touch the chip contact or one or more substrate contacts. A third bond element can be joined to ends of the first and second bond elements. In one embodiment, a bond element can have a looped connection, having first and second ends joined at a first contact and a middle portion joined to a second contact.

Inventors: Haba; Belgacem (Saratoga, CA), Damberg; Philip (Cupertino, CA), Osborn; Philip R. (San Jose, CA)

Assignee: Tessera, Inc.

International Classification: H01L 23/48 (20060101); H01L 29/40 (20060101); H01L 23/52 (20060101)

Expiration Date: 8/26/12018