Patent Number: 8,816,575

Title: Socket and lamp engagement configurations for a luminaire

Abstract: An LED module substrate includes a substrate main body, an LED mounted on one plane of the substrate main body, and a contact mounted at an edge of the one plane of the substrate main body and electrically connected to the LED. A cover section covers the LED module substrate in which the contact and the thermal radiation sheet are exposed. A lamp is attached to a socket. The socket includes a terminal electrically connected to the contact by the attachment of the lamp. A luminaire main body includes a thermal radiator including a contact surface and a recess. The lamp attached to the socket is brought into contact with and thermally connected to the contact surface. The recess is provided in a position opposed to the terminal of the socket.

Inventors: Kimiya; Junichi (Yokosuka, JP), Nezu; Kenji (Yokosuka, JP), Kato; Go (Yokosuka, JP), Tamaki; Yoshiyuki (Yokosuka, JP), Nakamura; Hiroto (Yokosuka, JP), Higuchi; Kazunari (Yokosuka, JP), Otsuka; Makoto (Minato-ku, JP), Tomizawa; Yoshiyuki (Minato-ku, JP)

Assignee: Toshiba Lighting & Technology Corporation

International Classification: H01J 1/02 (20060101); H01J 7/24 (20060101)

Expiration Date: 8/26/12018