Patent Number: 8,817,357

Title: Mechanical layer and methods of forming the same

Abstract: This disclosure provides mechanical layers and methods of forming the same. In one aspect, an electromechanical systems device includes a substrate and a mechanical layer having an actuated position and a relaxed position. The mechanical layer is spaced from the substrate to define a collapsible gap. The gap is in a collapsed condition when the mechanical layer is in the actuated position and in a non-collapsed condition when the mechanical layer is in the relaxed position. The mechanical layer includes a reflective layer, a conductive layer, and a supporting layer. The supporting layer is positioned between the reflective layer and the conductive layer and is configured to support the mechanical layer.

Inventors: Tao; Yi (San Jose, CA), Zhong; Fan (Fremont, CA), de Groot; Wilhelmus A. (Palo Alto, CA)

Assignee: Qualcomm MEMS Technologies, Inc.

International Classification: G02B 26/00 (20060101)

Expiration Date: 8/26/12018