Patent Number: 8,818,010

Title: Microphone unit

Abstract: Disclosed is a microphone unit comprising a film substrate (1), electrically conductive layers (15, 16) which are formed on both substrate surfaces of the film substrate (11), and an electrical acoustic transducer unit (12) which is provided on the film substrate (11) and comprises a diaphragm capable of converting a sound pressure to an electrical signal. In the microphone unit, the linear expansion coefficient of the film substrate (11), including the electrically conductive layers (15, 16), falls within the range of 0.8 to 2.5 times, inclusive, the linear expansion coefficient of the diaphragm.

Inventors: Inoda; Takeshi (Daito, JP), Horibe; Ryusuke (Daito, JP), Tanaka; Fuminori (Daito, JP), Ishida; Tomio (Daito, JP)

Assignee: Funai Electric Co., Ltd.

International Classification: H04R 9/08 (20060101); H04R 11/04 (20060101); H04R 17/02 (20060101); H04R 19/04 (20060101); H04R 21/02 (20060101); H04R 25/00 (20060101)

Expiration Date: 8/26/12018