Patent Number: 8,819,395

Title: Micro grid tiered computing system with plurality of complex shape structures interconnected by bridge modules in docking bays

Abstract: A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein.

Inventors: Oakenfull; Ian E. (Canberra, AU)

Assignee: International Business Machines Corporation

International Classification: G06F 15/16 (20060101); H05K 7/00 (20060101)

Expiration Date: 8/26/12018