Patent Number: 8,819,842

Title: Implementing conductive microcapsule rupture to generate a tamper event for data theft prevention

Abstract: A method and circuit for implementing conductive microcapsule rupture to generate a tamper event for data theft prevention, and a design structure on which the subject circuit resides are provided. A polymeric resin containing microcapsules surrounds a security card and a tamper sensor device provided with the securing card. Each microcapsule contains a conductive material. The conductive material of the microcapsule disperses onto the tamper sensor device on the security card responsive to the microcapsule being ruptured to create a change in resistance, reducing the resistance of a security mesh of the tamper sensor device. The microcapsules are more sensitive to pressure than a tamper mesh of the tamper sensor device and therefore rupture first, creating the change in resistance when dispersed onto the tamper sensor device. The resistance change is detected by the tamper sensor device and the security card is disabled to prevent data theft.

Inventors: Boday; Dylan J. (Tucson, AZ), Kuczynski; Joseph (Rochester, MN), Wertz; Jason T. (Wappingers Falls, NY), Zhang; Jing (Poughkeepsie, NY)

Assignee: International Business Machines Corporation

International Classification: G06F 21/00 (20130101)

Expiration Date: 8/26/12018