Patent Number: 8,819,918

Title: Manufacturing method for a dual interface card

Abstract: A method of manufacturing a chip card, such as a dual interface card, is provided. The method generally includes collocating multiple card support sheets one onto the other, depositing a conductive adhesive onto contact pads on at least one of the sheets, positioning a dual interface module in a recess established in at least one of the sheets, and executing a lamination step.

Inventors: Ayala; Stephane (Palezieux Gare, CH), Carre; Lionel (Seeg, DE), Curty; Jari-Pascal (Nyon, CH)

Assignee: Assa Abloy AB

International Classification: H01Q 13/00 (20060101)

Expiration Date: 9/02/12018