Patent Number: 8,819,933

Title: Method for forming a current distribution structure

Abstract: A method for forming an electrical structure. The electrical structure comprises an interconnect structure and a substrate. The substrate comprises an electrically conductive pad and a plurality of wire traces electrically connected to the electrically conductive pad. The electrically conductive pad is electrically and mechanically connected to the interconnect structure. The plurality of wire traces comprises a first wire trace, a second wire trace, a third wire trace, and a fourth wire trace. The first wire trace and second wire trace are each electrically connected to a first side of the electrically conductive pad. The third wire trace is electrically connected to a second side of the electrically conductive pad. The fourth wire trace is electrically connected to a third side of said first electrically conductive pad. The plurality of wire traces are configured to distribute a current.

Inventors: Daubenspeck; Timothy Harrison (Colchester, VT), Gambino; Jeffrey Peter (Westford, VT), Muzzy; Christopher David (Burlington, VT), Sauter; Wolfgang (Richmond, VT)

Assignee: International Business Machines Corporation

International Classification: H01R 43/02 (20060101)

Expiration Date: 9/02/12018