Patent Number: 8,820,200

Title: Modular die system

Abstract: Modular die set includes upper die shoe; lower die shoe, which has a first length, width, and thickness, and which is provided with an opening spanning a substantial, extensive portion of the first length and width of the lower die shoe, such that material can pass freely through the opening the first thickness of the lower die shoe and pass through the lower die shoe; and set of plural movable supports, which can be closely spaced or spaced apart in relation to one another, which can be selected and stationed to support a tooling subassembly and avoid any hole(s) in a lower tooling plate of the tooling subassembly such that scrap and/or parts to fall through the hole(s) can fall through the opening of the lower die shoe. The modular die can be mounted within a press, and parts made therewith.

Inventors: Quinn; Robert Richard (Washington Township, Macomb County, MI)


International Classification: B26D 1/00 (20060101)

Expiration Date: 9/02/12018