Patent Number: 8,821,009

Title: Thermal sensors having flexible substrates and use thereof

Abstract: Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor the platform temperature. Fabricating the resonator on a relatively low cost flexible polymer substrate rather than silicon provides mechanical flexibility as well as design flexibility with respect to sensor placement. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

Inventors: Abdelmoneum; Mohamed A. (Portland, OR), Kaysen; David A. (Hillsboro, OR)

Assignee: Intel Corporation

International Classification: G01K 11/26 (20060101); G01K 7/32 (20060101)

Expiration Date: 9/02/12018