Patent Number: 8,822,003

Title: Component having an overlapping laser track; method for producing such a component

Abstract: A component having a laser track as a fracture initiation line, said laser track being composed of laser holes formed by a laser beam for preparing for a later separation of the component into individual components. In order to ensure that, upon separation, the fracture always extends along the laser track, fractures deviating from the laser track are avoided, and the fracture edges after fracture are formed evenly and do not have jagged edges, it is proposed that the distance between two adjacent laser holes be less than or equal to the diameter of said laser holes, in each case measured on the surface of the component.

Inventors: Reiss; Kunibert (Pechbrunn, DE), Karl; Thomas (Wunsiedel, DE), Kluge; Claus Peter (Roslau, DE)

Assignee: CeramTec GmbH

International Classification: B32B 3/24 (20060101)

Expiration Date: 9/02/12018