Patent Number: 8,822,048

Title: Paste composition and printed circuit board

Abstract: A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1). ##STR00001##

Inventors: Ebe; Hirofumi (Ibaraki, JP), Inoue; Shinichi (Ibaraki, JP), Furukawa; Yoshihiro (Ibaraki, JP)

Assignee: Nitto Denko Corporation

International Classification: H01M 2/02 (20060101); H01M 14/00 (20060101); H05K 5/03 (20060101); B32B 33/00 (20060101)

Expiration Date: 9/02/12018