Patent Number: 8,822,126

Title: Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate, and method of manufacturing relief printing plate

Abstract: The invention provides a resin composition for laser engraving, having a binder polymer containing at least one of a structure unit represented by the following Formula (I) or a structure unit represented by the following Formula (II). In the Formulae, Q represents a partial structure which provides an acid group having an acid dissociation constant pKa of 0 to 20 when it is in the form of -Q-H; R.sup.1 to R.sup.3 each independently represent a hydrogen atom or a monovalent organic group; and A and B each independently represent a bivalent organic connecting group. The invention further provides a relief printing plate precursor having a relief forming layer containing the resin composition, a method for manufacturing a relief printing plate having crosslinking components of the relief forming layer and laser engraving the relief forming layer, and a relief printing plate formed thereby. ##STR00001##

Inventors: Sugasaki; Atsushi (Shizuoka-ken, JP)

Assignee: FUJIFILM Corporation

International Classification: B32B 5/00 (20060101); B29C 35/08 (20060101); G03F 7/20 (20060101); C08G 79/08 (20060101); G03F 7/004 (20060101); C08F 30/06 (20060101)

Expiration Date: 9/02/12018