Patent Number: 8,822,238

Title: Apparatus and method for predetermined component placement to a target platform

Abstract: A method for placing a component on a target platform includes providing component alignment marks, target platform reference marks, a first multiple-sensor probe including first sensors, and a second multiple-sensor probe including third sensors. The method further includes determining second sensors included in the first sensors, and sensing a first signal from a first one of the alignment marks by at least one of the second sensors. The method further includes determining fourth sensors included in the third sensors. The method further includes sensing a second signal from a second one of the alignment marks by at least one of the fourth sensors, and detecting a deviation of the component from the target platform associated with a first position of one of the second sensors that sense the first signal and a second position of one of the fourth sensors that sense the second signal.

Inventors: Chen; Kong-Chen (San Jose, CA)

Assignee: Wintec Industries, Inc.

International Classification: H01L 21/00 (20060101)

Expiration Date: 9/02/12018