Patent Number: 8,822,239

Title: Manufacturing method for semiconductor device

Abstract: A semiconductor device includes: a semiconductor substrate including an active element formation face on which an active element is formed; detection electrodes detecting a remaining amount of ink by being wet in the ink; an antenna transmitting and receiving information; a storage circuit storing information relating to the ink; and a control circuit controlling the detection electrodes, the antenna, and the storage circuit.

Inventors: Hashimoto; Nobuaki (Suwa, JP)

Assignee: Seiko Epson Corporation

International Classification: B41J 2/175 (20060101)

Expiration Date: 9/02/12018