Patent Number: 8,822,271

Title: Method and apparatus for manufacturing chip package

Abstract: There are proposed a method and apparatus for manufacturing a chip package in which bonding wires are coupled with contact pads in which an overhang holder holds and fixes portions of a surface adjacent to portions where the contact pads are located.

Inventors: Joh; Cheol Ho (Icheon-si, KR)

Assignee: SK Hynix Inc.

International Classification: H01L 21/00 (20060101); H01L 23/02 (20060101)

Expiration Date: 9/02/12018