Patent Number: 8,822,832

Title: Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board

Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.

Inventors: Moon; Jin Seok (Suwon, KR), Yoo; Seong Hyun (Suwon, KR), Lee; Keun Yong (Suwon, KR), Lee; Hyun Jun (Suwon, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: H01B 3/40 (20060101); H05K 1/00 (20060101); B32B 27/38 (20060101); C09K 19/54 (20060101); C09K 19/38 (20060101); C08L 63/00 (20060101)

Expiration Date: 9/02/12018