Patent Number: 8,822,841

Title: Package substrate and fabricating method thereof

Abstract: Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.

Inventors: Lee; Dong Gyu (Seoul, KR), Choi; Jin Won (Gyeonggi-do, KR), Jeong; Sung Won (Gyeongsangnam-do, KR), Lee; Dae Young (Gyeonggi-do, KR), Lee; Gi Sub (Busan, KR), Kim; Jin Ho (Gyeonggi-do, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: H05K 1/11 (20060101); H01K 3/10 (20060101)

Expiration Date: 9/02/12018