Patent Number: 8,822,993

Title: Integrated circuit including sensor structure, related method and design structure

Abstract: An Integrated Circuit (IC) and a method of making the same. In one embodiment, an integrated circuit includes: a substrate; a first metal layer disposed on the substrate and including a sensor structure configured to indicate a crack in a portion of the integrated circuit; and a second metal layer disposed proximate the first metal layer, the second metal layer including a wire component disposed proximate the sensor structure.

Inventors: Cooney, III; Edward C. (Jericho, VT), Gambino; Jeffrey P. (Westford, VT), He; Zhong-Xiang (Essex Junction, VT), Lee; Tom C. (Essex Junction, VT)

Assignee: International Business Machines Corporation

International Classification: H01L 23/58 (20060101); H01L 21/66 (20060101)

Expiration Date: 9/02/12018