Patent Number: 8,823,053

Title: Semiconductor device including a plurality of first flat plates containing a material that absorbs an electromagnetic wave at a high frequency

Abstract: The semiconductor device includes a plurality of first flat plates containing a material that absorbs an electromagnetic wave at a high frequency. Any of the first flat plates is disposed above the first connecting wire, and any other of the first flat plates is disposed above the second connecting wire.

Inventors: Sakiyama; Yoko (Kawasaki, JP), Morizuka; Kohei (Himeji, JP)

Assignee: Kabushiki Kaisha Toshiba

International Classification: H01L 29/66 (20060101)

Expiration Date: 9/02/12018