Patent Number: 8,823,153

Title: Semiconductor package

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.

Inventors: Kim; Tae Hoon (Gyunggi-do, KR), Choi; Seog Moon (Gyunggi-do, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: H01L 23/48 (20060101)

Expiration Date: 9/02/12018