Patent Number: 8,823,154

Title: Encapsulation architectures for utilizing flexible barrier films

Abstract: An article and method of using spacer layer regions is provided, containing a gas compound, to reduce gas permeation through barrier films overlying a substrate comprising creating a spacer layer between one or more of the barrier films, wherein the spacer layer comprises at least one inert gaseous compound. In another embodiment, an article and method is provided comprising creating alternating thin films of hybridized sol-gel spin-on glass and PDMS based and olefin based elastomers.

Inventors: Hawker; Craig J. (Santa Barbara, CA), Granstrom; Jimmy (Santa Barbara, CA), Campos; Luis M. (Santa Barbara, CA), Gerbec; Jeffrey A. (Goleta, CA), Furukawa; Motoko (Goleta, CA)

Assignee: The Regents of The University of California

International Classification: H01L 23/20 (20060101)

Expiration Date: 9/02/12018