Patent Number: 8,823,161

Title: Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures

Abstract: A semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface, a chip pad disposed on the first surface of the substrate, and a through-silicon via (TSV) including a plurality of sub vias electrically connected to the chip pad at different positions.

Inventors: Kim; Seong Cheol (Anseong-si, KR)

Assignee: SK Hynix Inc.

International Classification: H01L 23/04 (20060101)

Expiration Date: 9/02/12018