Patent Number: 8,823,183

Title: Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package

Abstract: A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere.

Inventors: Kim; Ki Young (Seongnam-si, KR), Chung; Qwan Ho (Seoul, KR), Hyun; Sung Ho (Seoul, KR), Park; Myung Gun (Seoul, KR), Bae; Jin Ho (Icheon-si, KR)

Assignee: SK Hynix Inc.

International Classification: H01L 23/48 (20060101)

Expiration Date: 9/02/12018