Patent Number: 8,823,185

Title: Semiconductor packages

Abstract: Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.

Inventors: O; In Won (Jeonju-si, KR), Kim; Woojae (Hwaseong-si, KR), Ro; YoungHoon (Hwaseong-si, KR), Youn; HanShin (Hwaseong-si, KR), Chung; Yechung (Hwaseong-si, KR), Choi; YunSeok (Hwaseong-si, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: H01L 23/48 (20060101); H01L 23/52 (20060101); H01L 23/28 (20060101)

Expiration Date: 9/02/12018