Patent Number: 8,823,247

Title: Piezoelectric vibrating devices including respective packages in which castellations include respective connecting electrodes

Abstract: Piezoelectric vibrating devices are disclosed that lack base through-holes and that can be manufactured on a wafer scale. Also disclosed are methods for making same. An exemplary piezoelectric device has a package base having first and second opposing main surfaces. On the second (outer) first main surface is formed a pair of external electrodes. The first (inner) main surface defines a first recess and a peripheral first bonding surface. A pair of connecting electrodes are provided for connecting to the respective external electrodes via respective edge surfaces of the package base that extend between the first and second main surfaces. A piezoelectric vibrating piece is mounted in and contained within the package base. The vibrating piece includes a pair of excitation electrodes electrically connected to respective connecting electrodes. A package lid comprises first and second main surfaces, of which the second (inner) main surface defines a second recess that is larger than the first recess. The second main surface also defines a second bonding surface that peripherally surrounds the second recess. A sealing material is applied, over the width of the second bonding surface, circumferentially between the first bonding surface and the second bonding surface.

Inventors: Ichikawa; Ryoichi (Saitama, JP), Amano; Yoshiaki (Saitama, JP)

Assignee: Nihon Dempa Kogyo Co., Ltd.

International Classification: H01L 41/08 (20060101)

Expiration Date: 9/02/12018