Patent Number: 8,870,047

Title: Wafer dicing press and method and semiconductor wafer dicing system including the same

Abstract: In a wafer dicing press for reducing time and cost for wafer dicing and for evenly applying a dicing pressure to a whole wafer, a wafer dicing press includes a support unit supporting a first side of a wafer; and a pressurization device applying a pressure, by dispersing the pressure, to a second side of the wafer so that a laser-scribed layer of the wafer operates as a division starting point. Accordingly, the wafer dicing press reduces laser radiation and pressure-application times for dividing a wafer into semiconductor devices. This increased efficiency is achieved without increasing the likelihood of damaging the wafer.

Inventors: Lim; Won-chul (Asan-si, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: H01L 21/78 (20060101); B30B 1/00 (20060101); B65H 35/10 (20060101)

Expiration Date: 2018-10-28 0:00:00