Patent Number: 8,870,562

Title: Motif-arraying apparatus

Abstract: A motif-arraying apparatus for arraying motifs such as a hot fix or the like in mounting grooves formed in a mold plate. The motif-arraying apparatus includes a shaking member for loading motifs in the mounting grooves formed in the mold plate, wherein the shaking member includes a vertical board and a horizontal board coupled to an edge thereof, and a plurality of shaking knives coupled to the bottom surface of the vertical board at a predetermined interval. The apparatus not only enables motifs to be correctly arrayed in the mounting grooves formed in the mold plate in a quick and easy manner, but also enables a motif inserted in a wrong direction to be removed from the mounting groove and correctly arrayed, thereby improving productivity, minimizing defects, and reducing costs.

Inventors: Hong; Duk Haui (Bucheon-si, KR)

Assignee:

International Classification: B29C 65/40 (20060101); D06Q 1/10 (20060101)

Expiration Date: 2018-10-28 0:00:00