Patent Number: 8,871,312

Title: Method of reducing plasma arcing on surfaces of semiconductor processing apparatus components in a plasma processing chamber

Abstract: Specialty ceramic materials which resist corrosion/erosion under semiconductor processing conditions which employ a corrosive/erosive plasma. The corrosive plasma may be a halogen-containing plasma. The specialty ceramic materials have been modified to provide a controlled electrical resistivity which suppresses plasma arcing potential.

Inventors: Sun; Jennifer Y. (Sunnyvale, CA), Collins; Kenneth S. (San Jose, CA), Duan; Ren-Guan (San Jose, CA), Thach; Senh (Union City, CA), Graves; Thomas (Los Altos, CA), He; Xiaoming (Arcadia, CA), Yuan; Jie (San Jose, CA)

Assignee: Applied Materials, Inc.

International Classification: C04B 35/505 (20060101); B32B 18/00 (20060101)

Expiration Date: 2018-10-28 0:00:00