Patent Number: 8,871,535

Title: Method for manufacturing LED

Abstract: A method for manufacturing an LED package includes following steps: providing a base with an LED chip mounted on the base; providing a porous carrier with a plurality of holes, and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film; providing a mold, and putting the porous carrier, the base, the LED chip, and the film into the mold; extracting air from the mold to an external environment through the holes of the porous carrier, and/or, blowing air toward the film to urge the film to move toward the LED chip, resulting in that the film is conformably attached onto the LED chip and the base; and solidifying the phosphor layer on the LED chip by means of heating whereby the phosphor is conformably and securely attached on the LED chip.

Inventors: Lo; Hsing-Fen (Hsinchu, TW), Chang; Chieh-Ling (Hsinchu, TW)

Assignee: Advanced Optoelectronic Technology, Inc.

International Classification: H01L 33/50 (20100101)

Expiration Date: 2018-10-28 0:00:00