Patent Number: 8,871,632

Title: Reduction of pore fill material dewetting

Abstract: In one embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, includes operations comprising: providing a structure comprising a first layer overlying a substrate, where the first layer comprises a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer, where the filling material comprises a polymer and at least one additive, where the at least one additive comprises at least one of a surfactant, a high molecular weight polymer and a solvent (e.g., a high boiling point solvent); and after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores uniformly across an area of the first layer, where heating the structure results in residual filling material being uniformly left on the surface of the first layer.

Inventors: Dubois; Geraud Jean-Michel (San Jose, CA), Frot; Theo J. (Los Gatos, CA), Magbitang; Teddie P. (San Jose, CA), Volksen; Willi (San Jose, CA)

Assignee: International Business Machines Corporation

International Classification: H01L 21/4763 (20060101)

Expiration Date: 2018-10-28 0:00:00