Patent Number: 8,871,660

Title: Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body

Abstract: There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90.degree. in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2.degree. or less.

Inventors: Yoshizaki; Kazuyuki (Tokyo, JP), Ito; Teppei (Tokyo, JP), Onozuka; Iji (Tokyo, JP), Nakamura; Kensuke (Tokyo, JP)

Assignee: Sumitomo Bakelite Co., Ltd.

International Classification: B32B 15/14 (20060101); B32B 27/38 (20060101); B29C 65/00 (20060101); D04H 13/00 (20060101); D03D 13/00 (20060101); H05K 1/03 (20060101); B32B 5/26 (20060101); B32B 5/08 (20060101)

Expiration Date: 2018-10-28 0:00:00