Patent Number: 8,871,890

Title: Curable resin composition and cured article

Abstract: Disclosed is a curable resin composition which includes a ladder-type silsesquioxane (A) having an aliphatic carbon-carbon double bond in the molecule; a ladder-type silsesquioxane (B) having a Si--H bond in the molecule; and a hydrosilylation catalyst. The curable resin composition is useful as sealants typically for optical semiconductor elements. Also disclosed is a cured article which is obtained by curing the curable resin composition. The curable resin composition can give such a cured article having properties including resistance to elevated temperatures, flexibility, transparency, resistance to thermal yellowing, and resistance to photoyellowing.

Inventors: Inoue; Keizo (Himeji, JP), Kamuro; Shigeaki (Himeji, JP)

Assignee: Daicel Corporation

International Classification: C08G 77/12 (20060101)

Expiration Date: 2018-10-28 0:00:00