Patent Number: 8,872,313

Title: Package apparatus of power semiconductor device

Abstract: A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.

Inventors: Ushio; Takayuki (Chiyoda-ku, JP), Oguri; Yoshihisa (Chiyoda-ku, JP), Goto; Akira (Chiyoda-ku, JP), Kanazawa; Jyunya (Shibuya-ku, JP)

Assignee: Mitsubishi Electric Corporation

International Classification: B65D 81/113 (20060101)

Expiration Date: 2018-10-28 0:00:00