Patent Number: 8,872,325

Title: Semiconductor device including an insulating layer and heat sink plates formed in the insulating layer

Abstract: A semiconductor device has a substrate, a semiconductor chip mounted on the substrate, an encapsulating body encapsulating the semiconductor chip on the substrate, and a plurality of heat sink plates embedded in the encapsulating body so as to have a surface that is exposed to an exterior of the encapsulating body and positioned on the same plane. The heat sink plates are spaced from each other.

Inventors: Watanabe; Yuji (Tokyo, JP)

Assignee: PS4 Luxco S.A.R.L.

International Classification: H01L 23/48 (20060101)

Expiration Date: 2018-10-28 0:00:00