Patent Number: 8,872,330

Title: Thin-film semiconductor component and component assembly

Abstract: A thin-film semiconductor component having a carrier layer and a layer stack which is arranged on the carrier layer, the layer stack containing a semiconductor material and being provided for emitting radiation, wherein a heat dissipating layer provided for cooling the semiconductor component is applied on the carrier layer. A component assembly is also disclosed.

Inventors: Herrmann; Siegfried (Neukirchen, DE), Hahn; Berthold (Hemau, DE)

Assignee: OSRAM Opto Semiconductors GmbH

International Classification: H01L 23/367 (20060101)

Expiration Date: 2018-10-28 0:00:00