Patent Number: 8,872,340

Title: Substrate for semiconductor package which can prevent the snapping of a circuit trace despite physical deformation of a semiconductor package and semiconductor package having the same

Abstract: A substrate for a semiconductor package includes: a first dielectric having a first surface and a second surface which faces away from the first surface and possesses waveform shaped portions, and formed with first holes penetrating the first and second surfaces; and circuit traces formed over the second surface of the first dielectric and having waveform shaped portions disposed over the waveform shaped portions of the second surface of the first dielectric. The waveform shaped portions of the second surface of the first dielectric and the waveform shaped portions of the circuit traces form a stress-resistant structure.

Inventors: Kim; Jong Hoon (Suwon-si, KR)

Assignee: SK Hynix Inc.

International Classification: H01L 23/498 (20060101)

Expiration Date: 2018-10-28 0:00:00