Patent Number: 8,876,274

Title: Pattern forming method

Abstract: A pattern forming method includes: performing a first droplet ejection step by ejecting droplets containing 0.1%-2% polysiloxane by mass onto a substrate; performing a first layer forming step by solidifying the droplets ejected onto the substrate so that a first layer is formed; performing a second droplet ejection step by ejecting more droplets over the first layer; and performing a second layer forming step by solidifying the droplets ejected onto the first layer so that a second layer is formed.

Inventors: Haneda; Yuya (Nagano, JP), Nozawa; Ryoichi (Nagano, JP)

Assignee: Seiko Epson Corporation

International Classification: C09D 11/00 (20140101)

Expiration Date: 2019-11-04 0:00:00